![Daniel Weber](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Daniel Weber
Direktor/Vorstandsmitglied bei
VIASYSTEMS GROUP, INC.
Vermögen: 16 Mio $ am 31.05.2026
Profil
Daniel J.
Weber currently serves as Secretary & Director at Viasystems Group, Inc., Secretary & Vice President at Viasystems North America, Inc. since 2012, and Secretary, Chief Legal Officer & Executive VP at TTM Technologies, Inc. since 2015.
Former roles include Director at Viasystems, Inc. from 2000 to 2015, General Counsel at International Wire Group Holdings, Inc. from 2000 to 2004, and Vice President & General Counsel at Courtesy Corp.
Education includes graduate studies at St. Louis University and undergraduate studies at the University of Kansas.
Bekannte Unternehmensbeteiligungen
| Unternehmen | Datum | Anzahl der Aktien | Bewertung | Datum der Bewertung |
|---|---|---|---|---|
| 11.03.2026 | 94’621 ( 0.09% ) | 16 Mio $ | 31.05.2026 |
Aktive Positionen von Daniel Weber
| Unternehmen | Position | Beginn |
|---|---|---|
| VIASYSTEMS GROUP, INC. | Direktor/Vorstandsmitglied | - |
| TTM TECHNOLOGIES, INC. | General Counsel | 01.01.2015 |
Viasystems North America, Inc.
 Viasystems North America, Inc. Electronic ComponentsElectronic Technology Designs, engineers, and manufactures printed circuit boards | Unternehmenssekretär | 31.05.2012 |
Ehemalige bekannte Positionen von Daniel Weber
| Unternehmen | Position | Ende |
|---|---|---|
Viasystems, Inc.
 Viasystems, Inc. Electronic ComponentsElectronic Technology Manufactures printed circuit boards and back panels | Direktor/Vorstandsmitglied | 01.05.2015 |
| INTERNATIONAL WIRE GROUP HOLDINGS INC | General Counsel | 01.03.2004 |
Courtesy Corp.
 Courtesy Corp. RestaurantsConsumer Services Owns and operates restaurants | General Counsel | - |
Ausbildung von Daniel Weber
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
51
Beziehungen ersten Grades
8
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Private Unternehmen | 8 |
|---|---|
International Wire Group Holdings, Inc.
 International Wire Group Holdings, Inc. Other Metals/MineralsNon-Energy Minerals Manufactures copper and alloy wire products | Non-Energy Minerals |
Viasystems, Inc.
Viasystems, Inc. Electronic ComponentsElectronic Technology Manufactures printed circuit boards and back panels | Electronic Technology |
Viasystems North America, Inc.
Viasystems North America, Inc. Electronic ComponentsElectronic Technology Designs, engineers, and manufactures printed circuit boards | Electronic Technology |
TTM Technologies, Inc.
 TTM Technologies, Inc. Electronic ComponentsElectronic Technology Manufactures printed circuit boards | Electronic Technology |
Viasystems Group, Inc.
 Viasystems Group, Inc. Electronic ComponentsElectronic Technology Provides complex multi-layer printed circuit boards and electro-mechanical solutions | Electronic Technology |
St. Louis University
 St. Louis University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
University of Kansas
 University of Kansas Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Courtesy Corp.
Courtesy Corp. RestaurantsConsumer Services Owns and operates restaurants | Consumer Services |
