Wen Ping Su

Tongyu Advanced Materials (Guangdong) Co., Ltd. principally engages in the research, development, production, and sale of electronic resins, which are mainly used in the production of copper clad laminates. Its key products include 4,4'-Diphenylmethane diisocyanate (MDI) modified epoxy resin, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) modified epoxy resin, high bromine epoxy resin, Bisphenol A-type phenolic epoxy resin, and phosphorus-containing phenolic resin curing agent. The company was founded on December 23, 2015 and is headquartered in Sihui, China.