![Patty Winters](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Profil
Patty Winters is currently the Vice President-Administration & Human Resources at Vertical Circuits, Inc. since 2004.
Prior to this, she worked as the Operations Director at Parallax Medical, Inc. from 2000 to 2003.
Aktive Positionen von Patty Winters
Unternehmen | Position | Beginn |
---|---|---|
Vertical Circuits, Inc.
![]() Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Verwaltungsdirektor | 01.01.2004 |
Ehemalige bekannte Positionen von Patty Winters
Unternehmen | Position | Ende |
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Parallax Medical, Inc. | Geschäftsführer | 01.01.2003 |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
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Führungskräfte
Unternehmensverbindungen
Private Unternehmen | 2 |
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Vertical Circuits, Inc.
![]() Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
Parallax Medical, Inc. |