Chung Shin Khoo
Chief Operating Officer bei UNISEM (M)
Profil
Chung Shin Khoo is currently the Chief Operating Officer & Senior Vice President at Unisem (M) Bhd.
He previously worked as a Senior Manager-Package Development at AIC Semiconductor Sdn.
Bhd.
and as a Vice President-Business Development at Unisem Chengdu Co. Ltd.
He completed his undergraduate degree at Oklahoma State University.
Aktive Positionen von Chung Shin Khoo
Unternehmen | Position | Beginn |
---|---|---|
UNISEM (M) | Chief Operating Officer | 01.03.2023 |
Ehemalige bekannte Positionen von Chung Shin Khoo
Unternehmen | Position | Ende |
---|---|---|
Unisem Chengdu Co. Ltd.
Unisem Chengdu Co. Ltd. SemiconductorsElectronic Technology Part of Unisem (M) Bhd., Unisem Chengdu Co. Ltd. is a private company that provides semiconductor wafer testing, integrated circuit packing and related services. The company is based in Chengdu, China. | Corporate Officer/Principal | - |
AIC Semiconductor Sdn. Bhd.
AIC Semiconductor Sdn. Bhd. SemiconductorsElectronic Technology AIC Semiconductor Sdn. Bhd. manufactures semiconductor devices. It offers smart card modules, chip scale package integrated circuit packages, small outline integrated circuit, plastic dual in-line package, thin shrink small outline package, very small outline package and thin small outline packages. The company was founded in 1995 and is headquartered in Kulim, Malaysia. | Corporate Officer/Principal | - |
Ausbildung von Chung Shin Khoo
Oklahoma State University | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Börsennotierte Unternehmen | 1 |
---|---|
UNISEM (M) | Electronic Technology |
Private Unternehmen | 2 |
---|---|
AIC Semiconductor Sdn. Bhd.
AIC Semiconductor Sdn. Bhd. SemiconductorsElectronic Technology AIC Semiconductor Sdn. Bhd. manufactures semiconductor devices. It offers smart card modules, chip scale package integrated circuit packages, small outline integrated circuit, plastic dual in-line package, thin shrink small outline package, very small outline package and thin small outline packages. The company was founded in 1995 and is headquartered in Kulim, Malaysia. | Electronic Technology |
Unisem Chengdu Co. Ltd.
Unisem Chengdu Co. Ltd. SemiconductorsElectronic Technology Part of Unisem (M) Bhd., Unisem Chengdu Co. Ltd. is a private company that provides semiconductor wafer testing, integrated circuit packing and related services. The company is based in Chengdu, China. | Electronic Technology |