Aktive Beziehungen
Name | Geschlecht | Alter | Unternehmensverbindungen | Zusammenarbeit |
---|---|---|---|---|
Ingu Yin Chang | M | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Peter A. Friedli | M | 70 |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Kenneth P. Lawler | M | 65 |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
William Watkins | M | 71 |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | 15 Jahre |
David John Savage | M | 63 |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Kevin Crowley | - | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Marc Robinson | M | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Charles Whyte | M | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Kevin R. Crowley | M | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Beziehungs-Chart
Beziehungen zu mehreren Unternehmen
Ehemalige Beziehungen
Name | Geschlecht | Alter | Unternehmensverbindungen | Zusammenarbeit |
---|---|---|---|---|
Richard Ruedy | M | 57 |
Parallax Medical, Inc.
| 4 Jahre |
Sunil Kaul | M | - |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Simon John Scott McElrea | M | 52 |
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | - |
Statistik
Land | Beziehungen | % des Gesamten |
---|---|---|
Vereinigte Staaten | 12 | 100,00% |
Alter der Beziehungen
Aktive
Vergangene
Herr
Frau
Aufsichtsräte
Führungskräfte
Ursprung der Beziehungen
- Börse
- Insiders
- Patty Winters
- Persönliches Netzwerk