Toshiyuki Yamagishi
Direktor/Vorstandsmitglied bei CASIO COMPUTER CO., LTD.
Aktive Positionen von Toshiyuki Yamagishi
Unternehmen | Position | Beginn | Ende |
---|---|---|---|
CASIO COMPUTER CO., LTD. | Direktor/Vorstandsmitglied | 01.06.2013 | - |
Corporate Officer/Principal | 01.06.2020 | - | |
Verwaltungsdirektor | 01.04.2009 | 01.12.2010 | |
Public Communications Contact | 01.10.2019 | 01.06.2020 | |
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Corporate Officer/Principal | 26.03.2012 | - |
Direktor/Vorstandsmitglied | 11.10.2011 | 26.03.2012 | |
Independent Dir/Board Member | 11.10.2011 | 26.03.2012 |
Karriereverlauf von Toshiyuki Yamagishi
Statistik
International
Japan | 3 |
Operativ
Director/Board Member | 2 |
Corporate Officer/Principal | 2 |
Independent Dir/Board Member | 1 |
Sektoral
Electronic Technology | 2 |
Consumer Durables | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
Börsennotierte Unternehmen | 1 |
---|---|
CASIO COMPUTER CO., LTD. | Consumer Durables |
Private Unternehmen | 1 |
---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
- Börse
- Insiders
- Toshiyuki Yamagishi
- Erfahrung