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Douglas M. Haines
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Karriereverlauf von Douglas M. Haines
Ehemalige bekannte Positionen von Douglas M. Haines
Unternehmen | Position | Beginn | Ende |
---|---|---|---|
ChipPAC, Inc.
![]() ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Direktor/Vorstandsmitglied | - | 31.10.2005 |
Statistik
International
Vereinigte Staaten | 2 |
Operativ
Director/Board Member | 1 |
Sektoral
Electronic Technology | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
Private Unternehmen | 1 |
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ChipPAC, Inc.
![]() ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | Electronic Technology |
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