Irmgard Bayerle
Investor Relations Contact bei ROODMICROTEC N.V.
Profil
Irmgard Bayerle is currently the Head-Investor Relations at RoodMicrotec NV since 2011.
Previously, he held the same position at Rood Testhouse International NV.
Aktive Positionen von Irmgard Bayerle
Unternehmen | Position | Beginn |
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ROODMICROTEC N.V. | Investor Relations Contact | - |
Ehemalige bekannte Positionen von Irmgard Bayerle
Unternehmen | Position | Ende |
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Rood Testhouse International NV
Rood Testhouse International NV Electronic Equipment/InstrumentsElectronic Technology Rood Testhouse International NV engages in development, production and service provision to the semiconductor industry which, includes testing semiconductors, optoelectronics, providing End-of-line manufacturing and service, developing test software for semiconductors, qualifying semiconductors and printed boards as well as printed boards assemblies. The company's services across wafer, packaged IC, printed board assembly, printed circuit board and interconnection technology, include, soldering, glueing, crimping covers: Engineering, test and programming Supply chain service and Qualification and failure analysis. The company was founded in 1976 and is headquartered in Zwolle, Netherlands. | Public Communications Contact | 03.08.2010 |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Börsennotierte Unternehmen | 1 |
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ROODMICROTEC N.V. | Commercial Services |
Private Unternehmen | 1 |
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Rood Testhouse International NV
Rood Testhouse International NV Electronic Equipment/InstrumentsElectronic Technology Rood Testhouse International NV engages in development, production and service provision to the semiconductor industry which, includes testing semiconductors, optoelectronics, providing End-of-line manufacturing and service, developing test software for semiconductors, qualifying semiconductors and printed boards as well as printed boards assemblies. The company's services across wafer, packaged IC, printed board assembly, printed circuit board and interconnection technology, include, soldering, glueing, crimping covers: Engineering, test and programming Supply chain service and Qualification and failure analysis. The company was founded in 1976 and is headquartered in Zwolle, Netherlands. | Electronic Technology |