Marc Robinson

Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.

IMP, Inc. designed, manufactured, and marketed value-added integrated circuits, high performance, standard analog. The company's main objective was to provide a broad portfolio of devices to manage the power supply needs of the portable, wireless and Internet-based systems that were driving computer and communications revolution. The company was founded in 1981 and was located in Santa Clara, CA.