Steven N. Lach
Präsident bei AGC Multi Material America, Inc.
Profil
Steven N.
Lach is currently the President at AGC Multi Material America, Inc. He previously worked as the Chief Executive Officer at Photocircuits Corp.
in 2006.
He also held the position of Vice President-North American Operations at Viasystems Corp.
and SVP-North American PCB Operations at Sanmina Corp.
in 2008.
Mr. Lach completed his undergraduate degree at the University of Nevada.
Aktive Positionen von Steven N. Lach
| Unternehmen | Position | Beginn |
|---|---|---|
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Präsident | 17.07.2018 |
Ehemalige bekannte Positionen von Steven N. Lach
| Unternehmen | Position | Ende |
|---|---|---|
| SANMINA CORPORATION | Corporate Officer/Principal | 01.04.2008 |
Photocircuits Corp.
 Photocircuits Corp. Computer PeripheralsElectronic Technology Photocircuits Corp. manufactures and distributes microchips. It makes printed circuit boards (PCB), produces automotive circuits, and multilayer interconnects. It has facilities and offices in Peachtree City, Heredia, Costa Rica; Batangas, Philippines, and Kunshan, China. The company was founded in 1951 and is headquartered in Glen Cove, NY. | Präsident | 01.08.2006 |
Viasystems Corp.
 Viasystems Corp. Electronic ComponentsElectronic Technology Viasystems Corp. was manufactured printed circuit boards. It was provided design assistance and engineering services in the early stages of product development. The company was founded in 1994 and was located in Beaverton, OR. | Geschäftsführer | - |
Ausbildung von Steven N. Lach
| University of Nevada | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 1 |
|---|---|
| SANMINA CORPORATION | Health Technology |
| Private Unternehmen | 3 |
|---|---|
Viasystems Corp.
Viasystems Corp. Electronic ComponentsElectronic Technology Viasystems Corp. was manufactured printed circuit boards. It was provided design assistance and engineering services in the early stages of product development. The company was founded in 1994 and was located in Beaverton, OR. | Electronic Technology |
Photocircuits Corp.
Photocircuits Corp. Computer PeripheralsElectronic Technology Photocircuits Corp. manufactures and distributes microchips. It makes printed circuit boards (PCB), produces automotive circuits, and multilayer interconnects. It has facilities and offices in Peachtree City, Heredia, Costa Rica; Batangas, Philippines, and Kunshan, China. The company was founded in 1951 and is headquartered in Glen Cove, NY. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
