![Bruce W. Hueners](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Bruce W. Hueners
Vorstandsvorsitzender bei Palomar Technologies, Inc.
Profil
Bruce W.
Hueners is currently the President & Chief Executive Officer at Palomar Technologies, Inc. He previously worked as a Principal at GE Aerospace.
He completed his undergraduate degree at the University of Southern California and holds an MBA from Indiana University.
Aktive Positionen von Bruce W. Hueners
Unternehmen | Position | Beginn |
---|---|---|
Palomar Technologies, Inc.
![]() Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Vorstandsvorsitzender | 01.01.2007 |
Ehemalige bekannte Positionen von Bruce W. Hueners
Unternehmen | Position | Ende |
---|---|---|
GE AEROSPACE | Corporate Officer/Principal | - |
Ausbildung von Bruce W. Hueners
Indiana University | Masters Business Admin |
University of Southern California | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Börsennotierte Unternehmen | 1 |
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GE AEROSPACE | Producer Manufacturing |
Private Unternehmen | 1 |
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Palomar Technologies, Inc.
![]() Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Electronic Technology |