Dennis P. McKenna
Keine laufenden Positionen mehr
Beziehungs-Chart
Beziehungen zu mehreren Unternehmen
Ehemalige Beziehungen
| Name | Geschlecht | Alter | Unternehmensverbindungen | Zusammenarbeit |
|---|---|---|---|---|
| Aaron Tachibana | M | 63 | 3 Jahre | |
| Yao Wu Yang | M | 73 | 4 Jahre | |
| Patricia Helen McCall | F | 68 |
ChipPAC, Inc.
 ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 1 Jahre |
| Douglas M. Haines | M | - |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | - |
| Michael Potter | M | 57 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | - |
| Joseph Martin | M | 76 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 2 Jahre |
| Mike Delaney | M | - |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | - |
| Robert J. Krakauer | M | 58 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 5 Jahre |
| Robert W. Conn | M | 81 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 2 Jahre |
| Richard M. Freeman | M | 75 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 3 Jahre |
| Albert Kim | M | - |
SkyCross, Inc.
 SkyCross, Inc. Telecommunications EquipmentElectronic Technology SkyCross, Inc. designs and manufactures advanced antenna and radio frequency solutions. Its products include mobile devices and wireless networks. The firm offers antenna design, antenna manufacturing and regional support services. It has offices in Gumi, San Jose, Shanghai, Shenzhen, Shenzhen, Suwon and Viera. The company was founded by Peter B. Atwal, Young-Min Jo, Christopher Morton and Eric D. Alterman in 2000 and is headquartered in San Jose, CA. | 8 Jahre |
| Shi Lian Wang | M | 64 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 3 Jahre |
| Mark Popovich | M | 61 |
ChipPAC, Inc.
ChipPAC, Inc. SemiconductorsElectronic Technology ChipPAC, Inc. principal activity is to provide semiconductor packaging, testing and distribution test services. It offers a portfolio of leaded and laminate packages for integrated circuits. It supplies packaging solutions to the semiconductor companies. It provides all packaging, test and distribution services from its facilities in Ichon and Chungju, South Korea, Shanghai, China and Kuala Lumpur, Malaysia. Atmel, IBM, Intel, STMicroelectronics and Texas Instruments are the major customers of the Group | 6 Jahre |
Statistik
| Land | Beziehungen | % des Gesamten |
|---|---|---|
| Vereinigte Staaten | 13 | 100,00% |
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