Joseph M. Zachman
Keine laufenden Positionen mehr
Karriereverlauf von Joseph M. Zachman
Ehemalige bekannte Positionen von Joseph M. Zachman
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| WABASH NATIONAL CORPORATION | Geschäftsführer | 01.05.2005 | 01.12.2009 |
| TTM TECHNOLOGIES, INC. | Corporate Officer/Principal | 01.12.2002 | 01.12.2004 |
| CDR Corp. | Präsident | 01.09.2001 | 01.12.2002 |
| Sanmina Corp. /Old/ | Geschäftsführer | 01.09.1997 | 01.09.2001 |
i3 Electronics, Inc.
 i3 Electronics, Inc. Electronic Production EquipmentElectronic Technology i3 Electronics, Inc. engages in the design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, and failure analysis laboratories. The firm offers PCB fabrication, heterogeneous MCM, die extraction and reassembly, electronic manufacturing services, cable and harness, and other related services. The company was founded in 2002 and is headquartered in Endicott, NY. | Geschäftsführer | 16.09.2010 | - |
Ausbildung von Joseph M. Zachman
| Kettering University | Graduate Degree |
| Purdue University | Undergraduate Degree |
Statistik
International
| Vereinigte Staaten | 8 |
Operativ
| Chief Operating Officer | 3 |
| Corporate Officer/Principal | 1 |
| President | 1 |
Sektoral
| Electronic Technology | 4 |
| Consumer Services | 3 |
| Producer Manufacturing | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Börsennotierte Unternehmen | 2 |
|---|---|
| WABASH NATIONAL CORPORATION | Producer Manufacturing |
| TTM TECHNOLOGIES, INC. | Electronic Technology |
| Private Unternehmen | 3 |
|---|---|
| Sanmina Corp. /Old/ | Electronic Technology |
i3 Electronics, Inc.
i3 Electronics, Inc. Electronic Production EquipmentElectronic Technology i3 Electronics, Inc. engages in the design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, and failure analysis laboratories. The firm offers PCB fabrication, heterogeneous MCM, die extraction and reassembly, electronic manufacturing services, cable and harness, and other related services. The company was founded in 2002 and is headquartered in Endicott, NY. | Electronic Technology |
| CDR Corp. |
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