![Takao Endo](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Takao Endo formerly worked at Oracle Corp Japan, as Chairman, President & Chief Executive Officer in 2013, Renesas Electronics Corp., as Chairman & Chief Executive Officer, Oracle Corp., as Senior Vice President, and IBM Japan, Inc., as SVP & GM-Business Transformation Outsourcing.
Mr. Endo received his undergraduate degree from the University of Tokyo.
| Unternehmen | Position | Ende |
|---|---|---|
| RENESAS ELECTRONICS CORPORATION | Vorstandsvorsitzender | - |
| ORACLE CORPORATION JAPAN | Vorstandsvorsitzender | 30.10.2013 |
IBM Japan, Inc.
 IBM Japan, Inc. Information Technology ServicesTechnology Services Provides integrated services from basic research to business consulting to IT system construction and maintenance | Corporate Officer/Principal | - |
| ORACLE CORPORATION | Corporate Officer/Principal | - |
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Börsennotierte Unternehmen
Private Unternehmen
| Private Unternehmen | 5 |
|---|---|
Oracle Corp.
 Oracle Corp. Packaged SoftwareTechnology Services Provides cloud based enterprise applications and infrastructure technologies & license, hardware and IT services | Technology Services |
Oracle Corp Japan
 Oracle Corp Japan Packaged SoftwareTechnology Services Develops and sells software, application, and database management systems | Technology Services |
IBM Japan, Inc.
IBM Japan, Inc. Information Technology ServicesTechnology Services Provides integrated services from basic research to business consulting to IT system construction and maintenance | Technology Services |
University of Tokyo
 University of Tokyo Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Renesas Electronics Corp.
 Renesas Electronics Corp. SemiconductorsElectronic Technology Provides research, development, design, manufacture, sale, and servicing of semiconductor products | Electronic Technology |
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